Joyce Weiner has over 25 years' experience in the semiconductor industry both in manufacturing and in product engineering. Her area of technical expertise is data science and using data to drive efficiency. She has presented technical papers at INFORMS Analytics and ASME InterPack and has been a Track chair for the ASME InterPack conference and others. She holds one US patent. Her book, “Why AI/Data Science Projects Fail: How to Avoid Project Pitfalls” was published in 2021.